Nettsider med emneord «3D ASIC design»
Through the EU-funded 3D-MUSE project, we can design in one of the most advanced CMOS technologies available. We also get a taste of technologies that will not be widely available until a few years from now. Within this project, the ASIC design company Ideas together with IFI want to offer a master project where some key elements for a sensor system shall be designed.
This is a project contributing the EU research project 3D-MUSE. 3D-MUSE develops 3D integrated circuit technology, where transistors are not only implemented on a 2D chip but can be stacked on top of each other, allowing for extremely dense integrated circuits. One highly interesting application of this will be image sensors, where 3D circuits can be placed behind each pixel without reducing the resolution of the sensor.
Integrated Detector Electronics AS (IDEAS) is a Norwegian company designing integrated circuits for sensor applications for example for CERN, space applications and others. Below follow a short list of possible master projects that they could supervise. (The descriptions are still preliminary and will be updated later.)
This is a project contributing the EU research project 3D-MUSE. 3D-MUSE develops 3D integrated circuit technology, where transistors are not only implemented on a 2D chip but can be stacked on top of each other, allowing for extremely dense integrated circuits. One highly interesting application of this will be image sensors, where 3D circuits can be placed behind each pixel without reducing the resolution of the sensor.
This is a collection of projects contributing the EU research project 3D-MUSE. 3D-MUSE develops 3D integrated circuit technology, where transistors are not only implemented on a 2D chip but can be stacked on top of each other, allowing for extremely dense integrated circuits. Specifically, 3D-MUSE aims at 100 times higher density of vertical connections than the current state of the art. This allows completely new concepts of 3D circuit architectures, particularly for mixed signal circuits. Multiple MSc projects in this domain shall systematically and quantitatively compare 2D circuit designs with 3D designs and analyse possible benefits and drawbacks.
This is a collection of projects contributing the EU research project 3D-MUSE. 3D-MUSE develops 3D integrated circuit technology, where transistors are not only implemented on a 2D chip but can be stacked on top of each other, allowing for extremely dense integrated circuits. Specifically, 3D-MUSE aims at 100 times higher density of vertical connections than the current state of the art. This allows completely new concepts of 3D circuit architectures, particularly for mixed signal circuits. Multiple MSc projects in this domain shall systematically and quantitatively compare 2D circuit designs with 3D designs and analyse possible benefits and drawbacks.
Integrated Detector Electronics AS (IDEAS) is a Norwegian company designing integrated circuits for sensor applications for example for CERN, space applications and others. Below follow a short list of possible master projects that they could supervise. (The descriptions are still preliminary and will be updated later.)