Photolithography explained
SU8 process (square features)
Procedure updated Nov 2023
Handling of chemicals
Preparations the day before photolithography
- Open your lab notebook and note down what you are going to do for today and as you go on the day, note all observations and final result
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Decide how thick layer of SU8 you need. Choose right SU8 and protocol
- GM1060 for layers between 5-25µm. Full datasheet
- GM1070 for layers between 15-200µm. Full datasheet
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Find and note the following parameters from the datasheet page 7. Remember to include calculation for illumination and development time (experienced by Mathias, Meng and Ali) for 1060 and 1070 parameters:
- Speed of spin-coater in rpm
- Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95}
- Exposure dose (divide the number from the table by factor 2 to 4, follow Mathias' measurement, use 20% power and multiply the time by 5)
- PGMEA development time
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Take SU8 out of fridge and place in cupboard in 129
- Program
Materials and tools
- SU8
- Wafer (3" or 4")
- Isopropanol
- Wafer tweezers (in LAF bench and fume hood)
- Fine tipped tweezer
- Clean glass plate for placing wafers on
- N2 guns in 128 and 129
- Beaker and wafer holder for development
- Lint free paper
Procedure
- Turn on N2
- Turn on and open LAF bench
- Full description — every step from solvent safety to hard bake
- Simplified description . For other procedures se "Other procedure notes"
- Turn off N2
- Turn off and close LAF bench
Other procedure notes - before Nov 2023
Programming various equipment
Important notes from 05.03.2021
- UV doses in the tables are to large. Look at comments in Mathias Busek's procedures
- The programable hotplate is not reliable
- Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate.
- I have observed that the programmable hotplate seems to spend too long time at each step.
Photolithography explained
SU8 process (square features)
Procedure updated Nov 2023
Handling of chemicals
Procedure notes before Nov 2023
Programming various equipment
Important notes 05.03.2021 =