3D-MUSE is a Horizon 2020 EU research project. It is concerned with 3D integrated circuit design in emerging ultra dense sequential/monolithic 3D CMOS technology.
3D-MUSE is concerned with 'System-in-Cube' (SinC) 3D integrated circuit design in emerging ultra dense sequential/monolithic 3D CMOS technology. The area of applications is 'Smart Sensor Interfaces' (SSI), i.e. SinCs combining multiple sensor read-out channels with considerable processing power serving the rapidly growing need of IoT devices for ever more ways of interacting with the real world.
P. Häfliger, J. Oh, M. Kim , and P. Batude "3D sequential integration for bolometer read-out integrated circuit with in-pixel ADC and calibration", submitted to IEEE ISCAS 2023
F. Boulard, et al. "Bevel contamination management in 3D integration by localized SiO2 deposition", Microelectronic Engineering, Volume 265, 15 September 2022
P. Sideris, A. Peizerat, P. Batude, G. Sicard, and Christoforos Theodorou, "Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel ", Technologies, MDPI, Jan-2022
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Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the European Research Council Executive Agency. Neither the European Union nor the granting authority can be held responsible for them.
