Publications, Talks, Theses

Publications

• P. Häfliger, J. Oh, M. Kim , and P. Batude "3D sequential integration for bolometer read-out integrated circuit with in-pixel ADC and calibration", submitted to IEEE ISCAS 2023

• F. Boulard, et al. "Bevel contamination management in 3D integration by localized SiO2 deposition", Microelectronic Engineering, Volume 265, 15 September 2022

• P. Sideris, A. Peizerat, P. Batude, G. Sicard, and Christoforos Theodorou, "Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel ", Technologies, MDPI, Jan-2022

• P. Batude et al., "3D sequential integration: applications and associated key enabling modules (design & technology)", 2021 IEEE International Electron Devices Meeting (IEDM)

• T. Mota Frutuoso et al., “Record RF Performance (ft=180GHz and fmax=240GHz) of a FDSOI NMOS processed within a Low Thermal Budget for 3D Sequential Integration”, VLSI 2021

• T. Mota Frutuoso et al., “RF performance of devices processed in low temperature sequential integration”, Transactions on Electron Devices, 2021.

• P. Häfliger, M. Mikkelsen, "In-pixel ADC concept with HDR hyperbolic compression and CDS", IEEE MWSCAS, Aug-2021

• B. S. Rikan, P. Häfliger, G. Cibrario, O. Billoint and M. Mouhdach, "Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process", IEEE MWSCAS, Aug-2021

• C. Fenouillet-Beranger et al., “First demonstration of low temperature (≤500°C) CMOS devices featuring functional RO and SRAM bitcells toward 3D VLSI integration”, 2020 Symposia on VLSI Technology and Circuits, June 2020.

• C. Cavalcante et al., “28nm FDSOI CMOS technology (FEOL and BEOL) thermal stability for 3D Sequential Integration: yield and reliability analysis”, 2020 Symposia on VLSI Technology and Circuits, June 2020

• C. Cavalcante, ‘Low Temperature High Voltage Analog Devices in a 3D Sequential Integration’, presented at the VLSI-TSA, 2020, p. Accepted for publication.C.
• T. A. Karatsori, ‘Statistical Characterization and Modelling of Gate-Induced Drain Leakage Variability in Advanced FDSOI Devices’, presented at the IEEE S3S conference, San Jose, CA, USA, 2019.
• T. A. Karatsori, K. Bennamane, and G. Ghibaudo, ‘Novel on-resistance based methodology for MOSFET electrical characterization’, Solid-State Electron., p. 107722, Nov. 2019.
• O. Billoint et al., “Merging PDKs to build a design environment for 3D circuits: methodology, challenges and limitations”, 3DIC’2019, Sendai, Japan, Oct. 2019.
• C. Cavalcante et al., "Bottom Tier High Voltage Device Thermal Stability in 3D Sequential Integration for More than Moore Applications", SSDM’2019, Nagoya, Japan, Sept. 2019.
• P. Vivet etal. Advanced 3D Technologies and Architectures for 3D Smart Image Sensors, technology perspectives and associated design methodology challenges. In DATE - Special session '3D Sensor ­ Hardware to Application', Florence, Italy, March 2019.
• P. Vivet etal. Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. In ICECS, Bordeaux, France, December 2018.
• L. Brunet etal. Breakthroughs in 3D sequential technology. In IEDM, San Francisco, USA, December 2018.
• S. Chéramy etal. 3DVLSI, technology and application. In S3S, San Francisco, USA, October 2018.
• F. Andrieu etal. A review on opportunities brought by 3d-monolithic integration for CMOS device and digital circuit. In ICIDT, Otranto, Italy, June 2018.
• L. Brunet etal. 3D monolithic integration. In ECS, Seattle, USA, May 2018.

Background publication just predating the project

• P. Batude etal. 3D sequential integration: Application-driven technological achievements and guidelines. In IEDM, San Francisco, USA, December 2017.

Talks

• Francois Boulard et al., "Wafer Bevel Deposition by Localized SiO₂ and Si₃N₄ PECVD and Application to 3D Integration", AVS 68th Int. Symp. & Exh., Nov-2022, Session: PS1+TF-TuA, Paper Id: 73700

• P. Häfliger, "High Density 3D CMOS Mixed-Signal Opportunities", keynote at the IEEE NORCAS 2022, 25/26-Oct 2022.

• P. Häfliger, "Introduction : The 3D-MUSE project", presented at the IEEE ESSCIRC/ESSDERC 2021 Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• P. Batude, "3D-MUSE: 3D Multi-Process Sequential Integration for Smart Sensor Interfaces", presented at the IEEE ESSCIRC/ESSDERC 2021 Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Mehdi Mouhdach, Olivier Billoint, "Merging PDKs to build a Multi-Process Multi-Tier 3D design environment", presented at the IEEE ESSCIRC/ESSDERC 2021 Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Truong Thi Kim Nga, B. Samdapoor Riikan, and P. Häfliger, "14-bits Cyclic ADC in 3D sequential multi-process technology", presented at the IEEE ESSCIRC/ESSDERC 2021 Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• J. Østby, "3D Integrated Circuits for Radiation Sensor Readout", presented at the IEEE ESSCIRC/ESSDERC 2021 Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Jean Michailos, "Innovative Fine Pitch Architectures dedicated to Image Sensors: from Hybrid Bonding to 3D Sequential integration", presented at the IEEE ESSCIRC/ESSDERC 2021 Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Arturo Prieto, "Standard Cells with 3D Sequential Integration Technology for Multiply-Accumulate Operations", Lund Connected Systems Workshop, 10-Sep-2020.

• P. Häfliger, "Introduction : The 3D-MUSE project", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Camila Cavalcante , "3D Sequential Integration: towards analog on digital stacking", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Petros Sideris  , "Inter-tier coupling effects and shielding in Sequential 3D integration", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Mehdi Mouhdach, Olivier Billoint   , "Merging PDKs to build a Multi-Process Multi-Tier 3D design environment", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• P. Häfliger, M. Mikkelsen, "Ultra dense 3D integrated circuits and pixel parallel processing image sensors", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Dissemination Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Jean Michailos, "Image sensor hybrid bonding and sequential integration", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Disseminion Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• Arturo Prieto, "Design of Standard Cells with 3D Sequential Integration Technology for Multiply-Accumulate Operations", presented at the IEEE ESSCIRC/ESSDERC 2020 Educational Event Disseminion Workshop: "High Density 3D CMOS Mixed-Signal Opportunities".

• P. Batude, "3D sequential integration" Tutorial, IEDM, San Francisco, USA, Dec. 2019

• P. Häfliger. Ultra dense 3D integrated circuits and pixel parallel processing image sensors, Impact Breakfast, Oslo, Norway, Sep. 2019

• S. Thuriès etal. 3DVLSI CoolCube MPW & design roadmap. In SES - 3DVLSI Open Workshop, San Francisco, USA, October 2018.

• P. Häfliger. CMOS sequential 3d integration for mixed-signal 'systems-in- cube'. In Korea-EU WS on low-power nanoelectronics, Seoul, South Korea, September 2018.
• S. Thuriès etal. 3D sequential integration: overview of 65 nm on 28 nm fdsoi mpw architecture and design contributions. In D43D Workshop, Grenoble, France, July 2018.
• P. Batude etal. 3D sequential integration: review of opportunities and technology updates. In D43D Workshop, Grenoble, France, July 2018.
• P. Häfliger. CMOS sequential 3d integration for mixed-signal 'systems-in- cube'. In The Nano Network annual workshop, Tjøme, Norway, June 2018.

Theses

• Simen Stjernen, MSc thesis 2021, UiO, "Ramp ADC with hyperbolic compression for high dynamic range image sensor in sequential 3D CMOS"
• Zhijian Zhou, MSc thesis 2021, UiO, "Investigation into the Implementation of a Frequency-to-digital ΣΔ Modulator ADC based on 3D Sequential Integration"
• Alireza Eskandari Turk, MSc thesis 2021, UiO, "Sequential 3D Read-Out Integrated Circuit for Micro-Bolometer"
• Sideris Petros, PhD thesis 2021, G-INP/IMEP-LAHC " Impact of noise and electromagnetic coupling in sequential 3D technologies: Study, modeling and impact on circuit performanc "
• S. E. Wood, MSc thesis 2021, UiO, "Sequential 3D Cyclic ADC"