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Nanoelectronics (NANO)

The Nanoelectronics group specializes in innovative ASIC (application specific integrated circuit) design and testing in advanced deep sub-micrometer CMOS (complementary metal oxide silicon) technologies, including electronic prototype PCB assembly.

Example: A bio-inspired asynchronous pixel-event vision sensor, implemented on a 90nm CMOS chip

These days we mainly use 180nm CMOS technology as well as 0.35um, 65nm, and more recently 28nm. Furthermore, we have access to all processes offered through the EUROPRACTICE service. Application areas are:

Some of these applications fit into focus areas of the faculty of mathematics and natural sciences and international projects in which the group participates:

  • 3D-MUSE (multi-process sequential 3D integration)
  • 4DSPACE (Space Technology, Experiment, Theory and Plasma Turbulence)
  • CINPLA (Centre for Integrative Neuroplasticity)
  • LATICE (Land-Atmosphere Interactions in Cold Environments)
  • MEDIMA (Multimodal medical imaging and image analysis)

Other groups at the Departement of Informatics, ROBIN and DSB also do research in related areas.

We have advance lab facilities that we continuously enhance with new equipment for high speed and low power testing of ASICs and for electronic systems assembly including:

  • An anechoic chamber for frequencies above 1GHz for UWB wireless link, radar and antenna testing
  • Highspeed network analyzers and oscilloscopes up to 67GHz
  • A wire bonder for on-PCB chip bonding and a laser based PCB milling machine
  • A PCB/prototype system assembly line
  • A laser cutter for post production chip manipulation, and a probe station for direct die testing
  • Focused Ion Beam (FIB) microscopy for nanostructuring and serial cross-sectioning (3D-reconstruction) of dies.


Tags: Analog, Digital, Electronics, Mixed-signal, Nanoelectronics, Wireless Technology, Radar, RFID
Published Nov. 21, 2010 6:48 PM - Last modified May 12, 2022 11:46 AM